PIP分子復(fù)合材?
PIP MOLECULE COMPOSITE
PIP分子復(fù)合材是一款由PI film與氟以及高分子材料結(jié)合而成的新型高分子材料，材料具有超薄、超平整度、完美的韌性等主要特性；它有力地結(jié)合了硅膠分子的熱性能、緩沖性能以及PI的獨(dú)特韌性及穩(wěn)定度，超薄且平整的材料是與傳統(tǒng)緩沖材最大之區(qū)別，其還具有厚度公差小、導(dǎo)熱速度快、單個位置使用率高等優(yōu)點(diǎn)，能滿足許多有特殊要求的設(shè)備使用。主要適用于高要求的熱壓設(shè)備，可隔絕超高溫產(chǎn)生的硅油與產(chǎn)品的直接接觸，對溫度有緩沖作用，使溫度較為均勻，超級平坦的表面可防止異物的殘留，以免影響熱壓頭因有殘留雜物而造成的熱壓效果，同時具有隔離保護(hù)作用。
PIP molecule composite is a composition of fluorine,PI film and polymer. It has very thin and flat characters. It integrates the heat property and cushioning from silicone molecule and the tenacity,stability from PI. Its advantages include that the tolerance of thickness is small and thermal conductivity performs well etc.It can isolate the silicone oil caused by high temperature to the products directly.
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PI film化學(xué)結(jié)構(gòu)圖機(jī)特點(diǎn)：
PI FILM CHEMICAL STRUCTURE CHARACTRISTIC：
1、PI film化學(xué)結(jié)構(gòu)具有超強(qiáng)的鋼性及韌性，作為一種特種工程材料，已廣泛應(yīng)用在航空、航天、微電子、納米、液晶、分離膜、激光等領(lǐng)域。
2、是目前已知綜合性能最佳的有機(jī)高分子材料之一，耐高溫達(dá) 400℃以上 ，長期使用溫度范圍-200~300℃，無明顯熔點(diǎn)，高絕緣性能，103 赫下介電常數(shù)4.0，介電損耗僅0.004~0.007，屬F至H級絕緣材料。
3、是作為導(dǎo)熱及緩沖材料最完美的基材，有分子結(jié)構(gòu)小、回復(fù)力量強(qiáng)等優(yōu)點(diǎn)。
1.?The chemical structure of PI film has hard tenacity. As a special engineering material, it has been applied to a lots of field such as aerospace,liquid crystal,laser etc.
2.?PI film is one of the best organic polymer materials, its thermal-resistance performance reaches above 400℃. it can be used for long term under -200~300℃. high insulative performance. Dielectric loss data range between 0.004-0.007,it belongs to F-H grade insulative material.
3.?It is the best base material for cushioning and heat conduction. Its molecule structure is small and its tensile strength performs well.
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PIP高分子復(fù)合材結(jié)構(gòu)圖 ：
PIP polymer composite structure：
PIP高分子復(fù)合材料使用PI film為基礎(chǔ)材料,結(jié)合各類高分子材料,可替代目前普通設(shè)備使用的氟材料、硅材料以及玻璃纖維等復(fù)合材料。
PIP polymer composite uses PI film as basic material, it combines kinds of polymer material, it can replace the ordinary fluorine material,silicone material and glass fiber composite etc.
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表面拒油性示意圖：
Anti-oil surface sketches：
產(chǎn)品型號Product model：
SIC-PIP50-100。
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產(chǎn)品用途：
1、適用于各類新型（柔性屏、3D眼鏡、OREDT、TP）COG與FOG綁定壓合過程的防護(hù)、緩沖和隔離，可替代目前普通設(shè)備使用的氟材料、硅材料以及玻璃纖維等復(fù)合材料。
2、主要替代目前傳統(tǒng)使用性能單一的壓合材料，與傳統(tǒng)壓合材料比有更輕薄、更平整、導(dǎo)熱快、受熱均勻、不滲油等特點(diǎn)。
3、特別適用于超級惡劣環(huán)境(高溫、耐油、高強(qiáng)度、高頻率)生產(chǎn)環(huán)境下的使用。
Usages of product:
1.?It can be applied to bonding procedure of COG and FOG for FPC,3D eyeglasses,OEDT and TP etc. As buffering tools.it can replace some composite glass fiber material such as fluorine,silicone etc.
2.?It can replace traditional compress material majorly. Comparing to traditional composite materials, SIC products are more thin and flat. The thermal conductivity performs fast and evenly.
3.?It can be applied to severe environment(high-temperature,high pressure,high frequency etc.)
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產(chǎn)品特點(diǎn)：
1、材料薄、厚度公差極小、表面平整、導(dǎo)熱均勻。
2、耐高壓、耐高溫、耐老化、高韌性、高導(dǎo)熱、不出油、無滲透性。
3、良好的緩沖性、回彈性。
4、具有超強(qiáng)的穩(wěn)定性，使用周期長，性能穩(wěn)定。
Features of product:
1.?Materials are thin and light, tolerance of thickness is small.thermal conductivity performs well.
2.?High-pressure resistance,high-temperature resistance,ageing resistance etc.
3.?Buffering performance and tensile resilience.
4.?Stable performance.
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產(chǎn)品規(guī)格：
1、（厚T：0.05mm*（寬W：5mm-500mm）*（長L：5-100m）;
2、SIC可按客戶需求定做其他規(guī)格及顏色產(chǎn)品。
Product specifications:
1.?(Thickness 0.05mm) * (width 5mm-500mm) * (length 5-100m).
2.?Products can be customized upon requests.
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性能參數(shù)PERFORMANCE
溫度的穩(wěn)定性&均勻性測試（上表格）:
相同位置不間斷測試20次，取溫度數(shù)據(jù)，差異不超過2度。
同時提高10度做測試，相同位置熱壓20次，數(shù)據(jù)溫差仍不超過2度。
數(shù)據(jù)表明，產(chǎn)品在高溫重復(fù)壓合之后，溫度及性能持續(xù)穩(wěn)定，可有效增加產(chǎn)品良率及生產(chǎn)效率。
Temperature stability and uniformity test:
Test 20 times at a same place, difference of data does not exceed 2 degrees.
Increase 10 degrees to press at a same time, difference of data still do not exceed 2 degrees.
